Humidity and SL-5170 Resin

From: Jim Harrison (Cutler Technologies)
Date: Wednesday, October 5, 1994

From: Jim Harrison (Cutler Technologies)
To: RP-ML
Date: Wednesday, October 5, 1994
Subject: Humidity and SL-5170 Resin

3D Systems is recommending a humidity level below 30% in labs using this 
resin.  Also, they recommending using isopropyl alcohol in place of a 
water rinse, dry nitrogen gas to dry parts, and parts stored or shipped 
in an airtight bag containing desiccant.  

Well, our lab is in South Florida were the humidity ranges between 70 and 
99.9% outside.  The recommendations by 3D Systems cost lots of $$$$ and 
I am not totally convinced that this is the best solution.  

The ultimate solution is to make the correction in the resin, which I 
have been told they are working on.  The other alternative, as usual, is 
up to us to figure out.  I am trying different methods, such as, a sealant 
to spray parts with, desiccant air compressor dryer and a few other 
things that did not work, to deal with the humidity issue.  

I have talked to others who have gone as far as using nitrogen to purge 
their vat chambers and cabinets, were the parts reside.  If there are 
other ideals I would like to hear them.  I will share my results and 
ideals with anyone interested.

Thanks,
Jim Harrison
Cutler Technologies
Phone:  305-653-9098
Fax:    305-653-9952


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