Humidity and SL-5170 Resin
From:
Jim Harrison (Cutler Technologies)
Date:
Wednesday, October 5, 1994
From: Jim Harrison (Cutler Technologies)
To: RP-ML
Date: Wednesday, October 5, 1994
Subject: Humidity and SL-5170 Resin
3D Systems is recommending a humidity level below 30% in labs using this
resin. Also, they recommending using isopropyl alcohol in place of a
water rinse, dry nitrogen gas to dry parts, and parts stored or shipped
in an airtight bag containing desiccant.
Well, our lab is in South Florida were the humidity ranges between 70 and
99.9% outside. The recommendations by 3D Systems cost lots of $$$$ and
I am not totally convinced that this is the best solution.
The ultimate solution is to make the correction in the resin, which I
have been told they are working on. The other alternative, as usual, is
up to us to figure out. I am trying different methods, such as, a sealant
to spray parts with, desiccant air compressor dryer and a few other
things that did not work, to deal with the humidity issue.
I have talked to others who have gone as far as using nitrogen to purge
their vat chambers and cabinets, were the parts reside. If there are
other ideals I would like to hear them. I will share my results and
ideals with anyone interested.
Thanks,
Jim Harrison
Cutler Technologies
Phone: 305-653-9098
Fax: 305-653-9952
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