Re: Humidity and SL-5170 Resin
From:
Tony Corpuz (Lockheed-Martin Corporation)
Date:
Thursday, October 6, 1994
From: Tony Corpuz (Lockheed-Martin Corporation)
To: Jim Harrison (Cutler Technologies), RP-ML
Date: Thursday, October 6, 1994
Subject: Re: Humidity and SL-5170 Resin
In Central Florida (Martin Marietta, Orlando) we are experiencing the
same problems. We have up to his point used dessicant in the PCA and in the
SLA-500 build chamber. In addition we have installed 3 dehumidifiers ($270/ea)
managing to get down to around 60%. If you look at our entire system (HVAC)
we now have 3 levels. 1) Factory air system that handles the main building,
2) two in lab AC units one with a dehimidifier and 3) three small units taking
out 7-8 gallons of water in a 24 hour period. We also have been told to get
down to a lower humidity (50% maximum, 30% ideal). This is expensive and
not very realistic especially in Florida. The real solution is reformulation
of the epoxy.
Tony Corpuz, Martin Marietta
Tel: 407-356-8303
Fax: 407-356-9235
Email: tony_corpuz@ccmail.orl.mmc.com
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