Int. Conf. on RP - Deadline

From: Agarwala, Mukesh K. (agarwamk@main.udri.udayton.edu)
Date: Tue Oct 15 1996 - 18:21:00 EEST


     ______________________________________
          FINAL REMINDER
     Oct. 17: Last Day for Submission of Abstracts
     ------------------------------------------------------------------

     The Seventh International Conference on Rapid Prototyping
               March 31 - April 3, 1997.
          Hyatt Regency, San Francisco Airport
               California, U.S.A.
     
     Co-sponsored by University of Dayton and Stanford University

After enthusiastic response and success in its first six years (1990-1995),
the ICRP is back for 1997. The ICRP is jointly organized and sponsored by
University of Dayton and Stanford University, both leaders in the Rapid
Prototyping Research and Technology. The Seventh ICRP will be held in the
San Francisco Bay area, first major RP conference of its kind on the west
coast. The ICRP will continue its successful tradition of providing a forum
for everyone interested in the exciting field of RP and offer a rare
opportunity to learn and exchange NEW information on all aspects of the
field and interact with participants from all over the world. The Conference

features:

     o Technical Sessions on Research & Development and Applications
     o Special Topic Workshops and Tutorials
     o A Trade Show Exhibition
     o Management Issues and Case Study Presentations

The focus of the technical sessions will include, but not limited to, the
following topics:

     o Rapid Prototyping Processes state-of-the art
     o Novel RP processes; new developments in existing RP processes
     o Precision and resolution in RP
     o Advanced process control
     o Rapid Tooling & direct tooling fabrication
     o 3D CAD Modeling
     o Alternatives to CAD for process/design inputs
     o Advances in computer interfaces for RP
     o Applications of RP
     o Case studies & management issues in RP
     o Use of RP in engineering and business strategies
     o Materials development for RP
     o RP process modeling
     o Functional prototyping and manufacturing
     o Medical modeling and applications
     o Other novel applications and experiences with RP technologies

Abstracts are invited for technical sessions in any of the above topics or
any other RP related topic. The abstracts should be limited to 250 words.
 Include title, authors, and their complete affiliations, and submit by
mail, FAX or e-mail before October 17, 1996 to:

     The International Conference on Rapid Prototyping
          Conference Coordinator
          The University of Dayton
      300 College Park, Dayton, OH 45469-0150, U.S.A.
          FAX: (513) 229-3433
                        e-mail: ICRP@udri.udayton.edu

Keeping in tradition with the past ICRP, conference proceedings will be made

available to conference participants at the Conference on March 31, 1997.
 To allow time for the review process, complete manuscripts of the abstracts

accepted for technical sessions will be due no later than Jan.10, 1997.

Conference registration forms and further information will be available
shortly. A limted block of rooms have been reserved for the Conference at
the Hyatt Regency San Francisco Airport, the Conference headquarters, at low

conference rates. Hotel reservation forms and other materials on travel
will also be available soon. For further information on the Conference,
trade show exposition, and hotel reservations, please refer to web site
http://www.udri.udayton.edu/conf/rapidpro/ or send e-mail to
ICRP@udri.udayton.edu



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