Dear colleague in RP area:
We are sorry for another redundent announcement of the Workshop in NIST.
We'd like to you give you an updated information including a tentative
agenda. Please take a minute for your reference.
--------------------------------------------------------------------
W O R K S H O P A N N O U N C E M E N T
-------------------------------------------------------------------
STEP-based SIF (Solid Interchange Format) Workshop
November 25, 1996
National Institute of Standards and Technology
Gaithersburg, MD 20899
Dear colleague,
We would like to invite you to participate in a new initiative to
develop a next-generation standard format for exchanging CAD-SFF
(Solid Freeform Fabrication) data. Current methods using the de facto
industry standard STL data format have at times resulted in problems
in the following areas:
- large file size for complex parts (due to redundency of data)
- part accuracy (due to approximation of the part shape)
- little product intelligence within the file, such as knowledge of
geometrical features or part surfaces
- model integrity
These issues and others will be discussed at this workshop to assess
industry needs and requirements for a next-generation CAD-SFF exchange
format. One current standardization effort that may play a role in
the proposed SIF is the STEP standard (ISO 10303) for representation
of product model data (see attached information). This approach will
be discussed at the workshop to assess its applicability. NIST provides
much technical expertise for development of the STEP standard and would
like to apply this experience to a new SIF standard, potentially STEP-based.
The one-day workshop is scheduled for November 25, 1996 to be held at
NIST, Gaithersburg, MD, USA. The agenda will include several keynote
presentations, a panel discussion session for targeting specific R&D
needs, and other relevant topics as follows:
--------------------------------------------------------------------------
T E N T A T I V E A G E N D A
--------------------------------------------------------------------------
8:30 - 9:25 Registration and Continental Breakfast
9:25 - 9:40 Announcements (Opening remarks)
9:40 - 10:00 Dr. Richard Jackson (Director, NIST Manufacturing Eng. Lab)
"NIST Support and Efforts for Solid Freeform Fabrication"
10:00 - 10:20 Dr. Mike Pratt (NIST IPA guest researcher from RPI)
"Introduction to STEP"
10:20 - 10:40 Mr. Kevin Lyons (DARPA program manager)
"DARPA program for SFF"
10:40 - 10:55 break
10:55 - 11:15 Dr. Jacob Jee (NIST guest researcher)
"A STEP-based SIF framework"
11:15 - 11:35 Prof. Amar Mukherjee (U. of Centroal Florida)
"A Geometric Slicer for SFF"
11:35 - 11:55 Prof. Carlo Sequin (U.C. Berkeley)
"CIF for VLSI chip layouts and SIF"
12:00 - 1:30 Lunch
1:30 - 3:20 Panel Presentation
Prof. David Rosen, (Georgia Institute of Tech.)
Dr. Charles Gilman (Manufacturing Solutions, Inc.)
Prof. Richard H. Crawford (U. of Texas)
Dr. Yong-Seok Suh (SDRC, Inc.)
Dr. Paul Fussell (Alcoa)
3:20 - 3:35 Break
3:35 - 4:45 Open Discussion on SIF Requirements
4:45 - 5:00 Workshop Summary / Future Actions
Directions to NIST: http://www.nist.gov/public_affairs/nistmaps.html
-------------------------------------------------------------------
In this workshop, we'd like to determine:
1. What will be the important features for Solid Interchange Format
2. What are some issues about design options for SIF
3. What are your efforts and problems for the SIF
Appropriate workshop materials and summaries of working sessions will
be included in a bound volume and will be distributed to participants.
There will be nominal registration fee of approximately $30 which will
cover registration materials, meals (breakfast, lunch, coffee breaks).
Additional information regarding the venue of the workshop, registration
information, workshop schedule, and accommodations will be distributed
upon request. If you require any additional information, please do not
hesitate to contact us.
We are looking forward to a very worthwhile event.
Sincerely,
Haeseong J. Jee, jacobjee@cme.nist.gov
Ram D. Sriram, Group Leader, sriram@cme.nist.gov
Mike Pratt, pratt@cme.nist.gov
Manufacturing Systems Integration Division
Engineering Design Technologies Group
National Institute of Standards and Technology
Bldg. 220, MS A127
Gaithersburg, MD 20899
Tel) 1-301-975-3818
Fax) 1-301-258-9749
Internet) http://www.nist.gov/msid
=====================================================================
WHAT IS STEP?
Since 1984 the International Organization for Standardization (ISO)
has been working on the development of a new standard for the exchange
of product data between computer-based systems in use for design and
manufacturing. STEP is the unofficial name for the evolving ISO standard
10303-Product Data Representation and Exchange. It will supersede
existing CAD data exchange formats such as IGES (a U.S. standard which
has been in use for more than ten years) and DXF (a proprietary format
developed by Autodesk mainly for exchange between PC-based CAD
systems). Whereas earlier formats were developed primarily for
the exchange of pure geometric data between design systems, STEP is
intended to handle a much wider range of product-related data covering
the entire life-cycle of a product.
The development of STEP has been one of the largest efforts ever
undertaken by ISO. Several hundred people from many different
countries have been involved. The scale of the documentation
generated is so large that the standard is being released in parts.
Currently there are twelve of these, but many more are in preparation,
dealing with specific product ranges and different aspects of the
product life-cycle.
Currently Solid Freeform Fabrication (SFF) is not one of the life-cycle
applications which has been dealt with by the STEP developers, but it
is believed that at least one of the currently released parts of STEP
could be relevant to SFF practitioners. The main pool of STEP
information is now provided by NIST STEP On-line Information Service,
or SOLIS. SOLIS can be accessed through the internet web page of the
NIST Manufacturing Systems Integration Division, http://www.nist.gov/msid.
=================== END OF MESSAGE ==================================
This archive was generated by hypermail 2.1.2 : Tue Jun 05 2001 - 22:37:40 EEST