Re: FW: Technologically Challenged

From: MICHELLE P WYATT 328-8537 (MICHELLE.P.WYATT@usa.dupont.com)
Date: Wed Apr 01 1998 - 02:16:36 EEST


Brock wrote:

> Also, although I don't like to admit my ignorance, I wouldn't be
surprised is
> the original photosensitve polymers were borrowed from the electronics
> packaging industry and reformulated. Perhaps someone at Ciby or Du Pont
or DSM
> can confirm that. In anycase, I don't think we need to rehash the
several
> historical conversations we have had on RPML about how this RP came to
be
> named RP when EEs and others were already using RP and what is RP
anyway.

DuPont Somos (R) is a business within a Strategic Business Unit (SBU) called
"Photopolymers and Electronic Materials", which includes a wide range of
materials. These materials not only include Somos(R), which is used in
stereolithography and sintering applications, but also materials that are being
used in emerging market segments such as semiconductor packaging, packaging
graphics and holography. DuPont has been involved in photopolymers for over
forty years, although the creation of the SBU that strongly links photopolymers
and electronic materials has existed less than two years. DuPont clearly
believes that there is a link between photopolymers and electronic materials,
and this is supported by over one billion dollars worth of sales within the SBU.

Sincerely,
Michelle P. Wyatt
Technical Marketing Engineer
DuPont Somos (R)
Two Penn's Way, Suite 401
New Castle, DE 19720
Tel: 302-328-8537
Fax: 302-328-5693
Email: Michelle.P.Wyatt@usa.dupont.com

Message-headers:
Date: Tue, 31 Mar 1998 15:39:04 EST
From: "Brock Hinzmann"@ESVAX-A1.EMAIL.DUPONT.COM
Subject: Re: FW: Technologically Challenged
Sender: owner-rp-ml <owner-rp-ml@bart.lpt.fi>
To: wayne l foss <wlfoss@cacd.rockwell.com>, rp-ml <rp-ml@bart.lpt.fi>
Reply-to: Brock Hinzmann <bhinzmann@sric.sri.com>
Message-id: <19980331204149.AAB29286@[128.18.35.51]>
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Wayne,

Sorry I wasn't here yesterday to respnd more quickly to your message. I
see today you have taken some heat for it.

In fact, in the literature and in reality, the EEs have been using the
term rapid prototyping far longer than the stereolithography/desktop
manufacturing folks. And the use was not only because they were into layering of
materials, but the entire notion of creating a working prototype and
testing it quickly, before investing millions or billions on production. Also,
although I don't like to admit my ignorance, I wouldn't be surprised is
the original photosensitve polymers were borrowed from the electronics
packaging industry and reformulated. Perhaps someone at Ciby or Du Pont or DSM
can confirm that. In anycase, I don't think we need to rehash the several
historical conversations we have had on RPML about how this RP came to be
named RP when EEs and others were already using RP and what is RP anyway.

Therefore, I'm not sure if you are having difficulty explaining rapid
prototyping to some EEs so much as trying to overcome one definition with
another. I suggest you try understanding it from the EE point of view.

good luck,
Brock Hinzmann

wayne l foss wrote:
>Brock Hinzmann wrote:
>>
>> Justin,
>>
>
>> Everyone is different. Consumers are different. They are not all
>> engineers (and engineers aren't all alike, either). We all think
>> differently and approach life differently.
>
>::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::
>
>Have you ever tried to explain rapid prototyping concepts to a
>electrical engineer?
>
>--
>=========================================================================
===
>==
>- Wayne L. Foss wlfoss@cacd.rockwell.com
>- Engineering Services Phone 319/295-2631
>- Rapid Prototyping Specialist FAX 319/295-5429
>- MS 106-176
>- Rockwell Collins
>- 400 Collins Road, NE
>- Cedar Rapids, IA 52498-3161
>-------------------------------------------------------------------------
-----
>DISCLAIMER: Unless otherwise indicated, this correspondence is personal
>opinion and NOT an official statement of Rockwell Avionics &
>Communications.
>-------------------------------------------------------------------------
-----
>
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Date: Tue, 31 Mar 1998 15:57:14 EST
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Wayne,

Sorry I wasn't here yesterday to respnd more quickly to your message. I see today you have taken some heat for it.

In fact, in the literature and in reality, the EEs have been using the term rapid prototyping far longer than the stereolithography/desktop manufacturing folks. And the use was not only because they were into layering of materials, but the entire notion of creating a working prototype and testing it quickly, before investing millions or billions on production. Also, although I don't like to admit my ignorance, I wouldn't be surprised is the original photosensitve polymers were borrowed from the electronics packaging industry and reformulated. Perhaps someone at Ciby or Du Pont or DSM can confirm that. In anycase, I don't think we need to rehash the several historical conversations we have had on RPML about how this RP came to be named RP when EEs and others were already using RP and what is RP anyway.

Therefore, I'm not sure if you are having difficulty explaining rapid prototyping to some EEs so much as trying to overcome one definition with another. I suggest you try understanding it from the EE point of view.

good luck,
Brock Hinzmann


wayne l foss wrote:

>Brock Hinzmann wrote:
>>
>> Justin,
>>
>
>> Everyone is different. Consumers are different. They are not all
>> engineers (and engineers aren't all alike, either). We all think
>> differently and approach life differently.
>
>::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::
>
>Have you ever tried to explain rapid prototyping concepts to a
>electrical engineer?
>
>--
>============================================================================
>==
>- Wayne L. Foss
wlfoss@cacd.rockwell.com
>- Engineering Services Phone 319/295-2631
>- Rapid Prototyping Specialist FAX 319/295-5429
>- MS 106-176
>- Rockwell Collins
>- 400 Collins Road, NE
>- Cedar Rapids, IA 52498-3161
>------------------------------------------------------------------------------
>DISCLAIMER: Unless otherwise indicated, this correspondence is personal
>opinion and NOT an official statement of Rockwell Avionics &
>Communications.
>------------------------------------------------------------------------------
>
>For more information about the rp-ml, see
http://ltk.hut.fi/rp-ml/
>
>RFC822 header
>-----------------------------------
>
<
owner-rp-ml@ltk.hut.fi>
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>Organization: Rockwell - CACD
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