RE: info needed on LOMcomposite material

From: James Ogg (OggJ@Helisys.com)
Date: Fri May 29 1998 - 20:00:58 EEST

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Kai,

Higher temperature materials are on the drawing board here at Helisys.
However,
we will probably not reach 5000F in the immediate future. ( Although
UDRI has done
some impressive work with CMCs on their 2030. ) Because the LOM process
functions primarily in the solid phase, it can handle some materials
that other processes
cannot.

However, the official temperature range for LGF is more conservative.
It can withstand
roughly 150F without post-processing, 300F with post-processing.

-James

>Original Message-----
From: Kai Uwe Koch [SMTP:kuk@IPA.FhG.de]
Sent: Tuesday, May 26, 1998 11:04 PM
To: SEELEUTHNER Yannick
Cc: RP-ML
Subject: Re: info needed on LOMcomposite material

Hi Yannick,

I can only provide you with a product description of LOMComposite.
Snip(Infos from Helisys data sheet)
The base material is a layer of nonwoven, randomly-oriented glass fibers
with two special coatings. The lower surface is finished with a
thermosetting epoxy, while a thin cover of a proprietary acrylic is
applied onto the upper surface.

Material Strengh: nine times stronger than LOMPaper
Operating temperature: maximum 2000F statically and 5000F dynamically
moisture resistance: less than 0.4% Z growth under 90% humidity withour
sealing.

Sample Applications: Plaster casting patterns, green sand casting
patterns, Thermoforming molds, Underwater test parts, Form, fit and
functional tests, Prototype injection molding.

Please remember I give this information as it is!!! Hope this helps.

Regards

Kai
________________________________________________________________________
Kai Uwe Koch E-Mail: kuk@ipa.fhg.de
Internet: http://www.ipa.fhg.de/
Fraunhofer-Institut
Produktionstechnik und Automatisierung
Nobelstrasse 12
D-70569 Stuttgart Phone: +49 711 970 1856
Germany Fax: +49 711 970 1004
________________________________________________________________________

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