Dear Allan, Dear RP world
we also developed a SiSiC process here at the IKP-University of
Stuttgart in cooperation with the DLR Stuttgart. You can find a paper in
the 1998 Austin-SFF proceedings. In contrast to the IWS-process we use
additional binders for a better "green part" strength. We infiltrate the
porous laser sintered structure with a precursor resin. Both, the binder
polymer and the infiltrated precursor become carbonized in a autoclave
process. After carbonization of the binder, the porous C/SiC structure
is infiltrated with silicon. The residual carbon of the polymers reacts
with the silicon and what we get is secondary SiC.
The IWS-process can be used for filigree structures. The IKP process can
be used for bigger parts which are difficult to handle in green part
stage.
regards,
Peter Stierlen
-- ________________________________________________________________________Peter Stierlen E-Mail: stierlen@ikp2.uni-stuttgart.de Institut für Kunststoffpruefung und Kunststoffkunde Universität Stuttgart Boeblingerstrasse 78E D-70199 Stuttgart Phone: +49 711 641 2276 Fax: +49 711 641 2264 ________________________________________________________________________
For more information about the rp-ml, see http://ltk.hut.fi/rp-ml/
This archive was generated by hypermail 2.1.2 : Tue Jun 05 2001 - 22:51:10 EEST