i originally posted this off-line, but the rest of you might be interested:
check out http://www.deepcoat.com.
these guys use vapor deposition to sheild all kinds of things, like cell
phone face plates, for example. they can put down aluminum, copper,
stainless, or custom tailored combinations. the advantage, aside from the
high shield effectiveness, is that it's about 1/10th the thickness of
spraylat-type metal loaded paints.
ben mccarter is the man to talk to.
will pattison, idsa
ignition
www.ignitioninc.com
-----Original Message-----
From: Doug Groh [mailto:douggroh@rapid.com]
Sent: Monday, February 05, 2001 8:58 AM
To: Eifert, Dan
Cc: 'lemaster@artcorp.com'; RP-ML (E-mail)
Subject: Re: vapor deposition of urethane castings
That , too was a good suggestion for sheilding, and it is also used for
Chromeplating!
Doug Groh
"Eifert, Dan" wrote:
> Bruce,
>
> Depending on the application you could apply a conductive paint as well.
I
> have used Choflex 601 from Chomerics as a shield layer for flex circuitry
> (polyimide film). It has excellent adhesion and provided nearly as much
> shielding as copper foil, more when you consider the paint coats edges and
> all voids. It is a silver loaded polyurethane. Contact Ron Sacuzzo at
> (800) 225-1936 if you are interested.
>
> -
> Dan Eifert
> Electronic Packaging
> Lockheed Martin M&FC-Orlando
> Ph - 407/356-5789
> Fax - 407/356-6725
> Email - dan.eifert@lmco.com
>
> -----Original Message-----
> From: Bruce [mailto:lemaster@artcorp.com]
> Sent: Monday, February 05, 2001 10:10 AM
> To: RP-ML (E-mail)
> Subject: vapor deposition of urethane castings
>
> Hello,
>
> Can any of you provide contacts for vapor depositing urethane? We have a
> customer that would like to create an RF shield on their prototypes and we
> believe that vapor deposition would be the best route. As an alternative,
> has anyone had success using "filled urethanes" to create conductive
> castings? We have tried using carbon black on several occasions with
mixed
> results. Typically, the amount of carbon black required to achieve any
> conductivity is so high that the urethane/carbon mixture becomes a thick
> sludge and will not flow into the molds.
>
> Thanks for your help,
>
> Bruce E. LeMaster
>
> Applied Rapid Technologies Corporation
> 265 Cambridge Street, Suite 100
> Fredericksburg, Virginia 22405
> (540)371-1100 / (540)371-4100 fax
> http://www.artcorp.com
>
> For more information about the rp-ml, see http://ltk.hut.fi/rp-ml/
>
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