From: Huck, John (jhuck@cessna.textron.com)
Date: Tue May 07 2002 - 19:07:18 EEST
RPML
Am currently considering a change to the RPC100 general purpose resin from
SL5195. The resin will be used on an SLA5000 machine. I am located in
Wichita, Kansas where the summers do get over 100 degrees F and at times the
humidity well above 50%. This does affect the SL5195 by swelling, growing,
and warping. Does anyone currently working with the RPC100 resin under
similar conditions experience these same problems? If so, to what degree?
How much do the SL parts swell, grow, and/or warp? If the heat and humidity
affect the parts at what temperature and humidity does this begin?
Everyone's' help will be greatly appreciated. Thanks to everyone in
advance.
For more information about the rp-ml, see http://rapid.lpt.fi/rp-ml/
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