[rp-ml] Call for papers "RP Japan 28th Symposium 2005" at Tokyo

Dear lists,

We, RP Society of Japan, announce the 28th Symposium which will be held
June 21, 2005 at Tokyo, Japan.

Objectives

For more than ten years now, RP Japan has been holding its "Rapid
Prototyping Symposium" twice, in spring and autumn, every year. To deepen
RP related exchange not only within Japan but with overseas as well,
presentations in English is promoted from 24th Japan Rapid Prototyping
Symposium. This symposium serves not only as a venue for presenting new
researches, but also plays the important role of providing valuable
information and know-how to all involved in RP. Research topics already
presented at other conferences are welcomed. Our focus is not on
originality, but the sharing of interesting technologies and research themes.

Areas of Interest

1. Novel rapid prototyping processes
2. Novel applications and experiments
3. Advances in existing processes
4. Advanced materials for RP
5. Process control, analysis and modeling
6. Precision and resolution in RP
7. Rapid tooling and direct tooling
8. Case studies and management issues
9. Worldwide RP trends and future prospects
10. Applications and related topics of RP

Trade Show

Following the conference, the 16th DESIGN ENGINEERING & MANUFACTURING
SOLUTIONS EXPO/CONFERENCE 2005 will be held from June 21 to 24 at Tokyo Big
Sight. It is cosponsored by RP Japan, and RP related devices and
technologies will be on display at the RP zone.

Preparation of Papers

Papers will be screened for acceptance based on abstracts received.
Preferably, papers should be submitted together with the abstracts.
Abstracts should be in English, exceeding no more than 200 words.
Authors will be notified of acceptance by March 11, 2005, at which point,
successful applicants will be asked to submit a printed version of their paper.
Papers are preferably written in English, and should not exceed 6 pages,
including the text, figures, tables, and references. Type on 21cm$B!_(B29.4cm
(A4 size) paper, leaving a 25 mm margin at the top and bottom, and a 20 mm
margin on the left and right sides of each page. For details, please refer
to the RP Japan homepage (http://www.rpjp.or.jp). Those submitting papers
already presented elsewhere must make sure that no copyright is violated at
their own responsibility.

Submission

Please send abstracts by e-mail or postal mail. If using E-mail, please
send by Microsoft Word file or PDF file.
You may also submit your paper at the same time.

Presentation Language

English or Japanese

Important Dates

1. Deadline for abstracts: February 18, 2005
2. Notification of acceptance: March 11, 2005
3. Deadline for papers: April 28, 2005

Travel Expenses

Provided in accordance with our Society rule. (Maximum: 50,000 yen)

Registration Method

To register, please return the following Registration Form by E-mail, fax,
or postal mail.

Registration Form

28th Japan Rapid Prototyping Symposium Secretariat
RP Japan
c/o Mrs. Katsue Nishiyama
14-104, Hitorizawa-cho 150-4, Isogo-ku, Yokohama, Kanagawa 235-0043, Japan
TEL/FAX: +81-45-771-4709
E-mail: rpjp@rpjp.or.jp
Homepage: http://www.rpjp.or.jp

Title of the Paper

Abstract

Surname: Name/s:

Title:

Organization:

Position:

Address:

Country:

Telephone:

Facsimile:

E-mail:

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Tsuneo Hagiwara, Ph. D. <thagiwara@hino.email.ne.jp>
Executive Committee of 28th RP Symposium of RP Japan

c/o CMET Inc.
2-5-5, Shin-Yokohama, Kouhoku-ku, Yokohama,222-0033, JAPAN
Phone: +81-45-478-5561, FAX: +81-45-478-5569
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