[rp-ml] Standard thermal post-cure process of SI-40 resin

Hi All,

Does anyone have the correct thermal post-cure process for SI-40 resin?

I believe it is this, but please concur or edit if it's off the mark:

        - ramp-up from room temperature to 80C over 2 hours.
        - hold for 2 hours at 80C
        - ramp back down to room temperature over at least 2 hours.

Thanks!

Ron DeFonce
Received on Tue Apr 04 18:53:39 2006