From: Baran M. Dag (anatolian79@gmail.com)
Date: Sat Mar 03 2007 - 11:07:07 EET
Hello Group,
European information regarding RP Tempering(TM) NanoComposite technology can
be found at:
RP Tempering(TM) will make SLA parts perform better as well as SLS, FDM,
POLYJET and 3DPRINTING parts.
Other than mechanical properties, RP Tempering(TM) will improve heat
properties(heat deflection, heat resistance), electrical (EMI/RFI Shielding)
and chemical properties.
The application is quick and easy, it consists of putting successive layers
of RP Tempering(TM) sprays and compounds on your part.
Please contact for more information.
Thank you,
Baran M. Dag
Sales Manager - Temperman
baran.dag@temperman.com
http://www.temperman.com
On 3/2/07, Laura Castillo <lcastillo@aimme.es> wrote:
>
> Hi all,
> do you know anybody in Europe to do that?
>
>
> *
> Laura Castillo*
> Unidad de Ingeniería de Producto
> AIMME-INSTITUTO TECNOLÓGICO METALMECÁNICO
> Parque Tecnológico, Avda. Leonardo Da Vinci, 38
> 46980 - PATERNA - VALENCIA - SPAIN
> Tel. +34 96 131 82 53 - Fax +34 96 136 61 45
> www.aimme.es - lcastillo@aimme.es
>
> <http://www.aimme.es/salto_banner.asp?id=99>
>
> ------------------------------
> *De:* owner-rp-ml@rapid.lpt.fi [mailto:owner-rp-ml@rapid.lpt.fi] *En
> nombre de *DeFonce, Ron C
> *Enviado el:* jueves, 01 de marzo de 2007 22:19
> *Para:* Rapid Prototype; rp-ml@rapid.lpt.fi
> *Asunto:* *SPAM*: 04.2/4.0 - RE: [rp-ml] SLA strength
>
> Bill,
>
> We have had great success with RePliForm.
> They are experienced in plating SLA parts, which greatly increases
> toughness/durability of parts.
>
> http://repliforminc.com/
>
> Good luck!
>
> Ron DeFonce
>
> ------------------------------
> *From:* Rapid Prototype [mailto:rapidproto@gmail.com]
> *Sent:* Thursday, March 01, 2007 1:19 PM
> *To:* rp-ml@rapid.lpt.fi
> *Subject:* [rp-ml] SLA strength
>
> I have a customer who uses SLA to fit test handles but they often break
> during the fit test. The part is not suitable for FDM because of the organic
> shape.
>
> Has anyone had experience with technologies used to strengthen SLA, and
> the associated costs.
>
> Thanks,
>
> Bill
>
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