Early work at the University of Dayton on linear shrinkage and warpage
in the SLA process confirmed the factors that affect shrinkage and
warpage and presented both analytical and experimental results in a
series of papers presented from1993 to 1995. These were presented at
The Dayton Conferences and The Austin SFF Conferences in those years.
Our papers entitled "Reducing Warpage in Stereolithography Through Novel
Draw Styles" by Ullett,et al.(1994), specifically examined in detail the
effects of changing draw styles. These papers are available in the
Proceedings of both conferences.
Richard P. Chartoff
Professor of Materials Engineering
University of Dayton
Dayton, Ohio 45469-0130
From: Yi XU
To: MR ALBIN A HASTBACKA
Subject: Re: Distortion Reduction in the SLA Process
Date: Wednesday, April 16, 1997 12:04PM
MR ALBIN A HASTBACKA wrote:
> -- [ From: Al Hastbacka * EMC.Ver #2.5.3 ] --
> Patent 5,429,908 by Bronson Hokuf of DuPont presents the idea of
> reducing distortion in the SLA process by writing non-continuous lines
> (dashed lines) which are then later filled in to reduce the
> distortion/curl in each layer of fabricating the model. Does anyone
> the list have any experience with this approach or similar approaches
> reducing the curl/distortion that exists when creating an SLA (or
> similar process) model?
> Al Hastbacka
I have done the similar research about the four years ago. It does
reduce the curl distortion. If you are interesting, i can send you a
copy of this paper.Unfortunately,it was written in Japanese. but you can
see the fig.
Nakagawa Lab. IIS.,University of Tokyo.
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