As an adjunct to Yakov's note about C-Mold software,
The University of Dayton offers a comprehensive service on mold design
with CAD based mold analysis and simulation using C-MOLD and MOLDFLOW.
This service also includes providing information and instruction on
3D-CAD and mold simulation to people who have no prior experience. We
also assist with part design, material property data base development
(necessary for the use of the mold simulation packages), mechanical
property testing, and material quality control issues.
If you would like further information on this, please contact us.
Richard P. Chartoff
Professor of Materials Engineering
University of Dayton
Center for Basic and Applied Polymer Research and
Ohio Rapid Prototype Process Development Consortium
Dayton, Ohio 45469-0130
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