microfluidic and photonic, hannover fair

From: microTEC info (info@microtec-d.com)
Date: Sat Mar 09 2002 - 14:32:24 EET

microTEC presents New Solutions For Packaging And Interconnection
in microfluidic and photonics

A major bottleneck in the applications of Microtechnologies are packaging
and inter-connection techniques, especially when users are searching for
solutions available on an industrial level. The task is to integrate single
micro technologies and provide a complete system. However not many packaging
solutions are available, if electronic and, for example, mechanical or
optical components must be integrated, to protect the system against harsh
environments and at the same time to be in contact with it to allow
measurements. A solution to solve an extremely wide range of pack-aging
problems is called 3D-CSP (3D-Chip-Size-Packaging), which is based on RMPD«
. The stepwise growth of the parts can be stopped at almost any processing
step, other components can then be integrated into the actual part, and the
production process be continued. Consequently, the parts, for example
microelec-tronic, microoptical, or micro mechanical parts, are integrated
("sealed") and pro-tected against the environment. A unique feature is the
possibility of RMPD« to allow the manufacture of three-dimensional channels.
These channels can be used to in-terconnect, for example, microelectronic
semiconductor chips. Orthogonal channels are not a must, so a flexible
packaging tool is provided. The new technology will combine both steps of
packaging and housing: the manufactured micro system itself provides a
complete housing. For details ask Reiner G÷tzen goetzen@microtec-d.com or
Helge Bohlmann bohlmann@microtec-d.com, contact 00492033062050.

Visit us at HANNOVER FAIR, April 15. - 20. Hall 5, Stand C18.

For more information about the rp-ml, see http://rapid.lpt.fi/rp-ml/

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