[rp-ml] Standard thermal post-cure process of SI-40 resin

From: DeFonce, Ron C <ron.c.defonce_at_boeing.com>
Date: Tue Apr 04 2006 - 21:32:36 EEST

Hi All,

Does anyone have the correct thermal post-cure process for SI-40 resin?

I believe it is this, but please concur or edit if it's off the mark:

        - ramp-up from room temperature to 80C over 2 hours.
        - hold for 2 hours at 80C
        - ramp back down to room temperature over at least 2 hours.


Ron DeFonce
Received on Tue Apr 04 18:53:39 2006

This archive was generated by hypermail 2.1.8 : Tue Jul 21 2009 - 10:27:51 EEST