RE: [rp-ml] Standard thermal post-cure process of SI-40 resin

From: Zubrickie, Robert F <>
Date: Wed Apr 05 2006 - 14:33:20 EEST

At our 3DS Users Group conference this year we will have a breakout
secession about Thermal post-cure. Visit our web site. See out
conference agenda for the details. If you are interested in attending.
All forms are in the Annual Conference area. The one you would be
looking for is the Attendee Registration Form.

Bob Z.

-----Original Message-----
From: [] On
Behalf Of DeFonce, Ron C
Sent: Tuesday, April 04, 2006 2:33 PM
Subject: [rp-ml] Standard thermal post-cure process of SI-40 resin

Hi All,

Does anyone have the correct thermal post-cure process for SI-40 resin?

I believe it is this, but please concur or edit if it's off the mark:

        - ramp-up from room temperature to 80C over 2 hours.
        - hold for 2 hours at 80C
        - ramp back down to room temperature over at least 2 hours.


Ron DeFonce
Received on Wed Apr 05 12:12:43 2006

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